Xtint Technologies
Design process
Requirements capture, architecture trade-offs, component selection, and feasibility studies before a line is drawn.
Circuit design, power architecture, signal integrity planning, and component sourcing.
Multi-layer stack-up design, high-speed routing, thermal management, and DFM/DFA review.
Prototype fabrication, assembly, bring-up, and debug — bench validation against the original spec.
Environmental, EMI/EMC, and reliability testing, plus documentation for manufacturing hand-off.
What we design
Mixed-signal & analog boards
Precision analog front ends alongside digital control, with careful noise isolation.
RF & wireless boards
Antenna matching, RF shielding, and layout for regulatory pre-compliance.
Power electronics
Battery management, isolated mains supplies, and high-current drive stages.
High-density digital boards
Multi-layer boards with BGA routing, DDR memory, and high-speed interfaces.